iNEMI launches webinar series focused on Low Temperature Soldering (LTS). This first webinar in the series will share information on Phase 1 of iNEMI's electromigration project in SnBi Solder for Second-Level Interconnect, which determines the effects of joint height, temperature, current density and of PCB finishes on reliability throughout the life of a product.
The low melting temperature (138°C) of SnBi alloys makes them interesting for the assembly of high-density microelectronic packaging, prone to deformation. However, bismuth (Bi) has a high propensity for electromigration and segregation at the anode under conditions of high current density, leading to potentially brittle solder joints with high electrical resistance over time spent on the field.
The Phase 1 project team used a planar geometry solder joint testing vehicle to study electromigration in low temperature solders such as SnBi. The novelty of their approach lies in the fact that planar solder joints connecting copper traces on printed circuit boards allow metallurgical and electromigration phenomena to be directly and non-destructively observed while monitoring resistance changes. in solder joints. This webinar will share the team's observations and analysis of the experiment results and discuss next steps.
Registration
This webinar is open to industry; prior registration is required. Two sessions are scheduled (with the same content).
Session 1
Tuesday October 17, 2023
10:00-11:00 a.m. EDT (Americas)
4:00 p.m. – 5:00 p.m. CEST (Europe)
10:00 a.m. – 11:00 p.m. CST (China)
Session 2
Wednesday October 18, 2023
9:00-10:00 CST (China)
9:00 p.m. – 10:00 p.m. EDT (Americas) October 17